What is Room Temp. Bonding?
Fundamentals of Room Temp.Bonding
Features of Room Temp. Bonding
- Rapid Bonding – complete to bond within few seconds theoretically
- High alignment accuracy – no shift after bonding
- No heat effect – under room temperature process
- Metal, Glass, Film --- any kinds of material can be bonded
- Possible to control the peel strength --- Not only Bonding process but also De-Bonding process can be available.
Room Temp. Bonding with Si Interlayer
In 2012, Lantechnical Service has developed "Room temperature bonding with using Si Interlayer" which is improved from the conventional Room Temperature bonding technology, with Suga Laboratory from the University of Tokyo. This technology makes possible to bond Glass and Glass, Glass and Polymer, Polymer and Polymer.
What is the difference? Conventional vs.Si Interlayer
Feature of Lantech's Room Temp. Bonding is to use Si Interlayer.We use Si Interlayer for the bonded interface.
This is our original method, and this is very unique technology.
What is the difference?Conventional vs. Si Interlayer
What Room Temp. Bond can do?
We can bond the materials with Room Temperature Bonding technology with Si Interlayer which is
improved from the conventional Room Temp. bonding technology. Example,
- Adhesives are not allowed.
- Applying Heat is not allowed
- Bond dissimilar materials
- Bond for De-Bond
Solved by Room Temp. Bonding
|Bondable||Glass and Glass, Glass and Film, Film and Film, Film and Metals --- Possible to bond Dissimilar materials.|
|Features of bonding||No Heat, No Adhesives. Intermolecular bonding.|
|Control of Peel strength||Not only strong bonding but also de-bonding if necessary. The peel strength can be controlled with Room Temp. Bonding|
Conditions of Room Temp. Bonding
Room Temp. Bonding is Direct Contact Bonding technology by Intermolecular bonding. They can be
bonded by low pressure contact if the surface roughness is below R-Max 10nm.
The rough surface material such as Metal, we can provide the solution of bonding based on the roughness of the materials.
Temporary bond and de-bonding technology
「Bond and De-Bond」The technology
For all kinds of devices, thinning them is an essential requirement. Our De-Bonding film which was developed in Glass-on-Glass structure is applicable to other materials.
- Carrier glass with Polymer film
- Carrier glass with Thin silicon wafer
- Carrier silicon wafer with Thin silicon wafer
A blade is inserted between the carrier substrate and the device substrate,
and then Blowing air from the nozzle ,thus allowing de-bonding.
Bonding -De-bonding technology -Ultra-thin Glass on carrier glass-
Features of Room Temp. Bonding
We propose the new process technology, alternative to the chemical HF polishing.
It is the solution of using the carrier glass to transfer the thin glass which is bonded by RTB.
A blade is inserted between the carrier substrate and the device substrate, and then the assembly is put into a pressure chamber, thus allowing De-Bonding.
Encapsulation "Flexible OLED lighting"
OLED Lighting Encapsulation
OLED lighting is the most suitable device for the Encapsulation by Room Temp.Bonding.