Temporary Bonding/Ultrasonic Vibration Debonding
Temporary bonding and debonding technology is an essential and critical technology in the semiconductor manufacturing process.
Our Temporary Bonding/Debonding technology is advanced and unique. No need to use heat, ultraviolet light, lasers, or organic materials.
In addition, our debonding performance can withstand high temperature environments.
Device substrate is temporaly bonded to carrier substrate by Room Temperature Bonding, and they can be easily Debonded with Ultrasonic Vibration after thinning process.
No need to use Heat, UV, laser or organic materials for this process.
Debonding Demo Video
Room Temperature Bonding
- What is room temperature bonding?
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This is one of the bonding method.
The features are:- No need organic adhesives
- No need UV or Laser
- No need Heat
- Bonding simply with contacting each other
- What is interlayer room temperature bonding?
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Until now, silicon wafers and other materials could be bonded by normal room temperature bonding, but ionic compounds (glass, etc.) and polymer films could not be bonded.
Our room temperature bonding technology makes this possible by using an interlayer.
A typical interlayer film is Si. Various interlayers can be selected according to the application.
Functionality can be added to the bonding film, such as conductive, conductive, permeable, etc.
Interlayer film: SI, SiC, Al, Cu, Cr, Ni, Ti, etc. can be selected.
- What are the materials that can be bonded together?
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Theoretically, all materials can be bonded.However, the surface roughness of the materials to be bonded is important. The required surface roughness varies depending on the material. Please contact us for details.
Transparent Bonding
Transparent Room Temperature Bonding
Conventional Si interlayer bonding is colored brown. Transparent room temperature bonding of new technology does not have coloring. We are looking for applications that need this technology.
Room temperature bonding which maintained transparency (99% or more) with our new transparent interlayer became possible.
We are researching various bonding methods and surface processes in addition to room temperature bonding to be able to contribute to all kinds of bonding methods.
Feel free to consult us
