Room Temperature Bonding

Room Temperature Bonding

What is room temperature bonding?

This is one of the bonding method.
The features are:

  1. No need organic adhesives
  2. No need UV or Laser
  3. No need Heat
  4. Bonding simply with contacting each other
What is room temperature bonding?
What is interlayer room temperature bonding?

Until now, silicon wafers and other materials could be bonded by normal room temperature bonding, but ionic compounds (glass, etc.) and polymer films could not be bonded.
Our room temperature bonding technology makes this possible by using an interlayer.
A typical interlayer film is Si. Various interlayers can be selected according to the application.

Functionality can be added to the bonding film, such as conductive, conductive, permeable, etc.

Interlayer film: SI, SiC, Al, Cu, Cr, Ni, Ti, etc. can be selected.

Silicon interlayer
What are the materials that can be bonded together?

Theoretically, all materials can be bonded.However, the surface roughness of the materials to be bonded is important. The required surface roughness varies depending on the material. Please contact us for details.

Bondable Materials

Temporary Bonding/Low Stress Debonding

Recently, there has been an increasing demand for thinner substrates. In such cases, temporary bonding to the carrier and debonding after the process is very important.
Can room temperature bonding technology be used for these processes?

Room temperature bonding is a technology that allows adjustment of bonding strength and does not use organic materials for such bonding.
Mechanical pressure, Thermal stress, or Ultraviolet light are not needed for the Debonding. The carrier is compatible with Si Wafer and glass Wafer, and the device side is also compatible with Si and SiC Wafer.

Temporary Bonding/Low Stress Debonding
Temporary Bonding/Low Stress Debonding

Applications of Temporary Bonding and Low Stress Debonding

  • Carrier SI Wafer and Device Wafer
  • Carrier Si Wafer and Glass Interposer
  • Bonding/Debonding of SiC Wafer

Transparent Bonding

Transparent Room Temperature Bonding

Conventional Si interlayer bonding is colored brown. Transparent room temperature bonding of new technology does not have coloring. We are looking for applications that need this technology.

Room temperature bonding which maintained transparency (99% or more) with our new transparent interlayer became possible.


Application field of transparent room temperature bonding

  • Optical element MEMS
  • Display
  • Optical element of laser

More than 99% permeability
We are exhibiting samples of transparent room temperature bonding.


We are researching various bonding methods and surface processes in addition to room temperature bonding to be able to contribute to all kinds of bonding methods.
Feel free to consult us