Surface polishing equipment
- Super-hard material polishing, metal polishing
- Polishing of curved and complex surfaces
- High precision optical lens polishing
- Local optimization of optical crystal polishing materials
- Diamond surface trimming
- Atomic precision machining of materials
- Ultra-smooth polishing
Surface Processing Equipment
FSBST
-
Item Parameter Wafer size ≤8inch Load model Cassette Wafer alignment Aligner Removal efficiency 800Å*cm2/s @Si Supporting process gas Ar/SF6/O2/He or other gas mixtures Beam intensity ＞100µA@Ar Beam size FWHM＜5mm Cluster ion energy 20/60keV -
GCIB
-
Item Parameter Wafer size ≤8inch Load model Manual/custom tool Removal efficiency 70Å*cm2/s @SiO2 Supporting process gas Ar/SF6/O2/He Or some other mixture of gases Beam intensity ＞100µA @Ar Beam size FWHM＜10mm Cluster ion energy 20/60keV -
Surface Cleaning equipment
SWC6P
-
Item Parameter Wafer size 150mm/200mm Wafer thickness 0.35-1.4mm Applicable Si, Si02,LT, LN,Sapphire,SiC,etc Clean part Double side Transmission system Full auto Clean method 1)Ultrapure water
2) Ammonia liquor
3) Amino acid Clean method
4) atomizing
5) PVA
6) Ozone waterUPH ＞12pcs Load method Cassette full auto Particle AFTClean ≤10EA(@≥0.3µm) surface metal AFT Clean ≤5e10 atoms/cm2 -
Measuring equipment
WPS
-
Item Parameter Alignment accuracy ±0.2µm Wafer size 4inch～12inch Load model Manual Pressure range 1-300N Pressure accuracy ≤±0.3% F.S. Optical scheme Visible/infrared -
IR-BVI
-
Item Parameter Wafer size ≤12inch Detection accuracy 150µm @12inch Infrared wavelength 0.75～5µm Load model Manual Equipment layout 450mm*450mm*1100mm Equipment weight 35kg -
